Reflow soldering processes : SMT, BGA, CSP and flip chip...

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Reflow soldering processes : SMT, BGA,...

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies

Ning-Cheng Lee

4.0 / 5.0

ఈ పుస్తకం ఎంతగా నచ్చింది?

దింపుకొన్న ఫైల్ నాణ్యత ఏమిటి?

పుస్తక నాణ్యత అంచనా వేయడాలనుకుంటే దీన్ని దింపుకోండి

దింపుకొన్న ఫైళ్ళ నాణ్యత ఏమిటి?

వర్గాలు:

సంవత్సరం:

2002

ప్రచురణకర్త:

Newnes

భాష:

english

పేజీల సంఖ్య:

273

ISBN 10:

008049224X

ISBN 13:

9780080492247

ఫైల్:

PDF, 12.65 MB

IPFS:

,

english, 2002

ఆన్‌లైన్‌లో చదవండి

కి మార్పిడి జరుగుతూ ఉంది.

కి మార్పిడి విఫలమైంది!

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IPC — IPC-7711 / IPC-7721: Rework, Modification and Repair of Electronic Assemblies (IPC-7711B / IPC-7721B)

FK Pan, Dell Hsu, Stanley Lin — SMT Application Notes for BGA / BGA 表面黏着作业说明书

— Basic Electronic Components & Hardware I

— Soldering of Electrical and Electronic Assemblies MIL-HDBK-2000 US DOD

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陶宗儀 — 說郛第六册

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John H. Lau — Flip Chip Technologies

John H. Lau, Ricky S.W. Lee, Ricky S. Lee — Chip Scale Package: Design, Materials, Process, Reliability, and Applications

R. S. KHANDPUR — Printed Circuit Boards: Design, Fabrication, Assembly and Testing

John H. Lau — Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Clyde F Coombs — Printed circuits handbook

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